SMAJ5.0A  力特現(xiàn)貨，2022年新貨，需要產(chǎn)品的可以出貨，量大價優(yōu)！

Description Features Maximum Ratings and Thermal Characteristics (TA=25OC unless otherwise noted) Parameter Symbol Value Unit Peak Pulse Power Dissipation at TA=25° by 10/1000us Waveform(Fig.2)(Note 1), (Note 2) -Single Die Parts PPPM 400 W Peak Pulse Power Dissipation at TA=25° by 10/1000us Waveform(Fig.2)(Note 1), (Note 2)-Stacked Die Parts(Note 5) PPPM 600 W Power Dissipation on Infinite Heat Sink at TL =50OC PD 3.3 W Peak Forward Surge Current, 8.3ms Single Half Sine Wave (Note 3) I FSM 60 A Maximum Instantaneous Forward Voltage at 25A for Unidirectional Only (Note 4) VF 3.5/5.0 V Operating Temperature Range TJ -65 to 150 °C Storage Temperature Range TSTG -65 to 175 °C Typical Thermal Resistance Junction to Lead RθJL 30 °C/W Typical Thermal Resistance Junction to Ambient RθJA 120 °C/W The SMAJ series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events. Applications TVS devices are ideal for the protection of I/O Interfaces, VCC bus and other vulnerable circuits used in Telecom, Computer, Industrial and Consumer electronic applications. ■ 400W Peak Pulse Power capability at 10/1000μs waveform, repetition rate (duty cycle): 0.01% ■ Excellent clamping capability ■ Typical IR less than 1μA when VBR min>12V ■ Surface mount footprint for compact PCB layout ■ Low profile package ■ Typical failure mode is short from over-specified voltage or current ■ Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c ■ IEC-61000-4-2 ESD 30kV(Air), 30kV (Contact) ■ ESD protection of data lines in accordance with IEC 61000-4-2 ■ EFT protection of data lines in accordance with IEC 61000- 4-4 ■ Built-in strain relief ■ Fast response time: typically less than 1.0ps from 0 Volts to VBR min ■ Glass passivated junction ■ Low inductance ■ High temperature to reflow soldering guaranteed: 260°C/30sec ■ VBR @ TJ= VBR@25°C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%) ■ Plastic package is flammability rated V-0 per UL-94. ■ Meet MSL level1, per J-STD-020, LF maximun peak of 260°C ■ Matte tin, lead–free plated ■ Halogen free and RoHS compliant ■ Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD609A.01) Uni-directional Bi-directional Functional Diagra

功能與特色:

• 無鹵素，且符合RoHS標準
• 表面封裝可優(yōu)化面板空間
• 小尺寸封裝
• 內(nèi)置式應(yīng)力消除
• 玻璃鈍化結(jié)
• 低電感
• 出色的箝位能力
• 重復(fù)頻率（工作循環(huán)）: 0.01%
• 快速的響應(yīng)時間: 從0伏特至V_BR的單向最小值通常小于1.0ps
• 電壓高于10V時，標準IR小于1mA
• 高溫焊接: 接線端250°C./10秒
• 塑料封裝已獲UL易燃性分級94V-O認證